Haozhe "Harry" Wang, Ph.D.
Electrical and Computer Engineering
Assistant Professor of Electrical and Computer Engineering
Education
- B.S. Shanghai Jiao Tong University (China), 2012
- M.S. Northwestern University, 2014
- M.Sc.Eng. Shanghai Jiao Tong University (China), 2015
- Ph.D. Massachusetts Institute of Technology, 2021
Trainings & Certifications
- Postdoctoral Scholar, Massachusetts Institute of Technology 2020 - 2021 (2020 - 2021) Massachusetts Institute of Technology
- KNI Prize Postdoctoral Fellow, California Institute of Technology 2021 - 2023 (2021 - 2023) California Institute of Technology
Positions
- Assistant Professor of Electrical and Computer Engineering
Awards, Honors, and Distinctions
- NSF Faculty Early Career Development (CAREER) Award. National Science Foundation. 2025
- KNI Prize Postdoctoral Fellowship. The Kavli Foundation. 2021
Courses Taught
- ECE 590: Advanced Topics in Electrical and Computer Engineering
- ECE 493: Projects in Electrical and Computer Engineering
- ECE 391: Projects in Electrical and Computer Engineering
- ECE 110L: Fundamentals of Electrical and Computer Engineering
- ECE 110L9: Fundamentals of Electrical and Computer Engineering - Lab
Publications
- Yang J, Yin RA, Jiang C, Hu Y, Zhu X, Hu X, et al. Zero-shot Autonomous Microscopy for Scalable and Intelligentn Characterization of 2D Materials. 2025.
- Silva-Quinones D, Hu X, Cole B, Bethke A, Hool A, Zhao Y, et al. Surface Termination Engineering of 2D Titanium Carbides for Light-Activated Soft Robotics Applications. American Chemical Society (ACS). 2025.
- Wang Z, Wang H, Caudillo R, Wang J, Liu Z, Foucher A, et al. Interfacial Oxidation of Metals on Graphene. ACS Applied Nano Materials. 2024 Nov 8;7(21):24537u201346.
- Hossain AA, Wang H, Catherall DS, Leung M, Knoops HCM, Renzas JR, et al. Isotropic plasma-thermal atomic layer etching of superconducting titanium nitride films using sequential exposures of molecular oxygen and SF6/H2 plasma. Journal of Vacuum Science and Technology A Vacuum Surfaces and Films. 2023 Dec 1;41(6).
- Wang J, Cheng C, Zheng X, Idrobo JC, Lu A-Y, Park J-H, et al. Cascaded compression of size distribution of nanopores in monolayer graphene. Nature. 2023 Nov;623(7989):956u201363.
- Wang H, Hossain A, Catherall D, Minnich AJ. Isotropic plasma-thermal atomic layer etching of aluminum nitride using SF6plasma and Al(CH3)3. Journal of Vacuum Science and Technology A Vacuum Surfaces and Films. 2023 May 1;41(3).
- Wang H, Minnich AJ. Oxidation-resistant metallic films: Surface engineering at the angstrom scale. Matter. 2022 Aug 3;5(8):2455u20137.
- Wang H, Yao Z, Jung GS, Song Q, Hempel M, Palacios T, et al. Frank-van der Merwe growth in bilayer graphene. Matter. 2021 Oct 6;4(10):3339u201353.
- Wang H, Yao Z, Acauan L, Kong J, Wardle BL. Toward MXene interconnects. Matter. 2021 May 5;4(5):1447u20139.
- Leong WS, Wang H, Yeo J, Martin-Martinez FJ, Zubair A, Shen P-C, et al. Paraffin-enabled graphene transfer. Nature communications. 2019 Feb;10(1):867.
- Fu S, Wang H, Wang X, Song Y, Kong J, Liu J. Self-Assembled, Ultrahigh Refractive Index Pseudo-Periodic Sn Nanostructures for Broad-Band Infrared Photon Management in Single Layer Graphene. ACS Photonics. 2019 Jan 16;6(1):50u20138.
- Wang H, Leong WS, Hu F, Ju L, Su C, Guo Y, et al. Low-Temperature Copper Bonding Strategy with Graphene Interlayer. ACS nano. 2018 Mar;12(3):2395u2013402.
- Wang H, Ju L, Guo Y, Mo X, Ma S, Hu A, et al. Interfacial morphology evolution of a novel room-temperature ultrasonic bonding method based on nanocone arrays. Applied Surface Science. 2015 Jan 1;324:849u201353.
- Liang J, Wang H, Hu A, Li M. IMC growth at the interface of Sn-2.0Ag-2.5Zn solder joints with Cu, Ni, and Ni-W substrates. Journal of Electronic Materials. 2014 Nov 1;43(11):4119u201325.
- Wang H, Peng L, Hu A, Li M. Investigation of ultrasonic bonding interface based on Ni micro-nano cones array. In: Proceedings of the Electronic Packaging Technology Conference EPTC. 2014. p. 247u201350.
- Wang H, Hu A, Li M. Synthesis of hierarchical mushroom-like cobalt nanostructures based on one-step galvanostatic electrochemical deposition. Crystengcomm. 2014 Sep 14;16(34):8015u20139.